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Hi Mr Yoon, Attached is IR test environment settings, let us know if you are accepted. Best regards Cooper |
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Hi Cooper. Here is our feedback about ABS IR receiver test as your plan. Please note that, the tape of example image is just reference. Please verify the masking tape of IR transparent before test. if you have any question, please contact me. Thanks SON |
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Hi SH, Attached is ABS IR test report, I follow your test method and result is pass, Thanks, Cooper |
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Hi Miya, and Cooper ALT reviewed ABS IR test report, the result is OK. Please proceed next step. Thanks SON |
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Hi SH Son Please let us know how many samples ALT/SKB need for test. Thanks. |
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Hi Miya, We're under checking it. Let me provide the sample q'ty to you shortly. Thanks Best Regards, Emma LEE |
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Hi Miya Here is Eagle T3 housing feedback by ALT Please improve on the next T4 sample. Also next T4 sample requires at least 3 sets each cavity. Thanks SON |
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Hi Miya, Regarding the old Dolby Audio logo update, please see the attached file. BR, Emma Lee |
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Hi Emma, Please see attached artwork. We update the LOGO of Dolby. Thanks. Miya. |
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Hi Miya, Thank you for your prompt response. There is no issue with the artwork, so please proceed with it. BR, Emma LEE |
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Hi Emma, Here is T4's picture. Sample will be sent to you within today. I will update waybill no. to you later. Thanks. Miya |
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Hi SH Attached is ABS IR test report (all housing) Thanks, Cooper |
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Hi Emma, Please see attached file about Eagle housing issue. Thanks Miya |
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Hi Miya 1. Here is Eagle T4 housing feedback by ALT The design feedback will be updated by Emma. Please improve on the next T5 sample. Also next T4 sample requires at least 5 sets each cavity. 2. Reliability test Please proceed Reliability test using T4 Thanks SON |
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Hi Miya, I'm writing regarding additional feedback as to Eagle T4 housing Please see the below and let me know if you have any questions. 1. Regarding design issues for housing 1.1. The Btv logo has to be flat with a top cover surface - We checked the improvement from T3 to T4. The logo of T4 sample is okay 1.2. The texture of top case surface is rough. - We checked the improvement from T3 to T4. The texture of T4 sample is okay 2. FII Request regarding the T5 - We approve proceeding with a golden sample to T5. As you know, if the status is not good, FII-ALT cannot move to the next step. Therefore, please help to improve the current issue and move without further problems. 3. T5 Samples q’ty Please send the quantity evenly for each cavity. BR Emma LEE |
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Hi Miya, Regarding the T5 Q'ty, please provide 20 sets (=one cavity:10 sets & another cavity: 10 sets). If you have any questions, please let me know. Thank you. BR Emma LEE |
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Hi Miya Please report the differences between the PC housing and ABS housing - cost difference - structure difference. And explain why did change the structure by FII : i.g LED light pipe, - Resin Properties (Data sheet compare table): PC vs ABS Thanks SON |
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HI Miya about thermal test, Please setup the test condition below - PCBA with shield can (current MP version) - ABS new housing. (T3, T4, or T5 is don't care) - Sw version : AndriodTV 10 (Mass production version) / AndroidTV 12(v15.537.6). customer request that report the temperature difference according to SW version. if you have any question, please contact me. Thanks SON |
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Hi Cooper, As discussed, please arrange the thermal test according to different software version and the above conditions provided by SH. Thanks! Regards, Sean |
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Hi SH, AndroidTV 12(v15.537.6) can't play 4K Video in this FW version, we use AndroidTV12 (v15.537.8) can play 4K Video normally, can we change from AndroidTV 12(v15.537.6) to 12(v15.537.8 )in this thermal test? Thanks Cooper |
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Hi, Cooper Kung 0001557:0012152 Confirm the thermal test AndroidTV12(v15.537.8) Thanks SON |
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Hi SH & Lonnie, Attached is thermal test result between AndriodTV 10(v15.534.28) and AndroidTV12 (v15.537.8) the result is pass, test repot will be upload before 2/22 Thanks Cooper |
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Hi SH & Lonnie, Upload thermal test report for AndriodTV 10(v15.534.28) and AndroidTV12 (v15.537.8) Thanks Cooper |
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Hi Miya, I'm sharing the T6 pictures. Please see the attached file and let us know if you have any questions. Thank you. Best Regards, Emma LEE |
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Hi Mr. Cooper Kung, Could you analyze the Thermal test result and its difference between below condition ? 1. Thermal test result comparison between ABS and PC. Does resin make some difference for thermal test result ? If yes, then can you expect the difference between Top and Bottom temperature difference ? And what about the difference between your expected value and real value ? 2. Thermal test result comparison between A10 and A12. As we mentioned before, SKB is very concerned about Temperature of STB. I may cause the VoC. Can you explain why there is difference A10 and A12 firmware ? We should explain what is the real root cause of temperature increase, OS change or Housing resin change. Best regards, SuhYoung YOON As I mentioned in weekly meeting, SKB concerned about thermal test result. So they didn't accept Shield can removal. But current result is similar test result without shield can. It means that SKB may not accept to resin change. So it is very critical situation. Please check the test result and find some factors to improve thermal test result. |
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Hi Emma We add one page about comparison of typecle value. Please kindly check and let me know if you have any confuse. Thanks. Miya |
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Hi Sh SON, Please see attached below. Thanks~ Miya |
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Hi Yoon We think ABS and PC thermal test result should be similar, becuase of they are both of plastic. We simultaneously arrange ABS + A12 + original 5W thermal pad for thermal test again on 3/1. If housing Temp result is still too margin, we will change thermal pad from 5W to 3W thermal pad to reduce housing Temp. Suppose the result can be approved, we can use this solution for ABS housing introduced. Besides, we also arrange ABS + A10 + 5W thermal pad for thermal test. it can prove whether the Temp rise is related to the firmware. The above tests are all changed to use the same PCBA with shield CAN for reduce variable. We think we can get more accurate test results and find the root cause. Regards Cooper |
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Hi Miya Wang Please check with resin vender that each resin of "Thermal Conductivity" please note below website. https://www.matweb.com/search/datasheet_print.aspx?matguid=0e450ebf4b6243748b6f65e479897da8 Top cover(old) Material: PC945A Bottom cover/Button(old) Material: PC+ABS GN5001SFC Top cover(new) Material: MABS TR557 HB Bottom cover/Button(new) Material: ABS HP171 HB Thanks SON image.png (44,572 bytes) |
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Hi Yoon Updated comparison table as attached, please see the sheet2. Case7 : re-test A12(v15.537.8) but result is fail Case8 : change thermal pad from 5W to 3W but result also fail => Thermal team feedback it is considered normal that the torrance of 1C Case9: removing middleware and the result is pass => So the A12 Temp rise is come from middleware. Regards Cooper |
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Hi Mr. Cooper Kung, 1. removing middleware A10 and A9 SW used Middleware. Why do you think A12 middleware only increase the temperature ? Please check it with your SW engineer, and explain it in SW word. If CPU temperature will increase when CPU load is higher than before. But the increase of SOC load was 7%, but the SoC Temperature was higher more than 7%. 2. CASE 9 : SoC - 53.3 C / Top 39.2 C CASE 6 : SoC - 56.7 C / Top 37.2 C I think that the major thermal source in STB is SoC. Why Top temperature of Case 6 is lower than Case 9, even SoC temperature in Case 6 is higher than Case 9 ? You can compare between Case 6 and Case 7.(I think both cases use same HW condition, but different SW version). Please explain what makes this result. As you know, we should accept SKB's approval before using new housing. We cannot explain why ABS / OS 12 increase temperature based on your result and explanation. Please analyze test result and explain how we can persuade SKB. BR S YOON |
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Hi Mr.Yoon, 1. After checking with Kerwin, the difference between these two A12 version is not just middleware, but also including other 3rd party applications, and there is a major difference we know is that Sptek add Google webview & Trichromelibrary to ensure UI can be developed due to the restiction of A12. The above software we got from Sptek and 3rd parties are binary file, So it's also hard for us to understand the detailed changes between A12, A10 and A9. For the temperature increasing percentage v.s. CPU loading, I believe that they are positive correlation but should not be exactly in equal proportion. 2. To cause the temperature of SoC is higher but the top temperature is lower, generally, it may caused by the K value of the thermal pad is low, which causes the heat to stay in the SoC and less heat is conducted to the top case. Also, according to our previous experience, it's also possible that the thermal pad is not fixed properly resulting in poor thermal conductivity, and the heat stays in the SoC. May I know why SKB/ALT keep asking for the A12 + ABS issue but not approving A10 + ABS even though we have passed the thermal test for A10 + ABS with a certain margin? Can SKB/ALT approve Eagle's A10 + ABS mass production in March first? and Fii will continue look into the thermal increasing issue of ABS + A12. Regards, Sean |
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Hi SH Son, Please check Thermal Conductivity status as attached. Thanks Miya image-2.png (18,976 bytes) |
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Hi Mr. SH, Ms. Emma, Fii's housing dep. said they are trying to refix the gas mark and wild lines, so they changed some conditions before MP. Gas mark and surface have been improved. Please check T8 version's report. And Sample will be sent by 3/17. I will let you know tracking no. later. Thanks. |
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Hi Yoon Attached is thermal test comparison table Case12 is A10 + PC housing test result, According to thermal team feedback: PC and ABS has difference heat conduction behavior PC bottom housing Temp.will higher than top housing because of PC has easier to concentrate heat at the bottom as case 1 and case 12 results. We will also test A12 + PC on 3/20 and update test result for you after test finished. Let us know if you have any question. regards Cooper |
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Hi Yoon, Here is A12+PC test results and thermal test reports, Please see the attached file The report contains the following: 1. ABS + A10 2. PC + A10 3. ABS + A12 4. PC+ A12 Regards Cooper |
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Hi Yoon Thermal pad manufacturer is ZIITEK Regards Cooepr |
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HI Miya, about Thermal Conductivity, Can you please request to LG Chem that the test Thermal Conductivity results using the ASTMC177 standard? Top cover(new) Material: MABS TR557 HB as you replied result, Different standards make it difficult to compare thanks SON |
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Hi SH Please check data sheet of MABS TR557 HB. Supplier change the standards to ASTMC177. Thanks Miya |
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Hi SH, Add other data sheets for ref. Please kindly check~ Thanks Miya |
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Hi Emma, Please check photos of "Old Mold+ABS". These photos were taken in the office, so they may look slightly different from the previous photos taken under IQC lighting. Thanks Miya |
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Hi Emma,SH Son Here are the photos I mentioned in E-mail. I will explain this situation via E-mail. Thanks. Miya |
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Hi Emma,SH Son Here is the updated file of [Mold Transfer 8D Report].PW is 123456 Please help to check and reply the approval E-mail Thanks. Miya |
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HI Miya 0001557:0014613 checked your SOP, Emma will send the email about mold transfer Thanks SON |
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Closed |
- yk.jung ( (ALTech) Younkwang Jung ) developer
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